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PRODUCTS SHOW

PRODUCTS SHOW

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OLED Automatic cutting equipment

OLED Automatic cutting equipment

Equipment core technical advantages

-UV femtosecond/picosecond laser cutting

-Unique spectroscopic technology to improve cutting efficiency

-Four-axis linkage function

-Line Scan accuracy detection

-The processing platform supports one-click replacement


Equipment application scenarios

-Compatible size 3 ~ 8 inch / 5 ~ 20 inch

-Corresponding to mobile phone screen/tablet screen shape cutting, flexible mobile phone screen camera hole punching, support single hole/double hole/track hole, compatible with three-sided shaped cutting



加工流程

自动上料自动定位自动切割自动去废自动Panel去废自动检查自动下料

产品OLED Pad Cut  3" ~ 8"(70mm×30mm~  210mm×110mm)
TT≤4.5 s/ea (8英寸)
Up Time Rate量产后Uprate≥99%(每天来料影响的设备类down机小于0.5h)
MTTR(平均恢复时间)≤4.5 s/ea (8英寸)
MTBF(平均故障间隔时间)≥1000hours
良率>99.7%
切割精度±30um
热影响≤30um



产品OLED Shape Cut  3寸~8寸(70mm×35mm ~210mm×150mm)  
TT≤4.5 s/ea (8英寸)
Up Time Rate量产后Uprate≥99%(每天来料影响的设备类down机小于0.5h)
MTTR(平均恢复时间)≤1Hours
MTBF(平均故障间隔时间)≥1000hours
良率>99.7%
切割精度±40um
热影响≤100um


产品OLED Hole Cut  3寸~8寸(70mm×35mm ~210mm×150mm) 
TT≤5.5 s/ea (8英寸,单孔产品)
Up Time Rate量产后Uprate≥99%(每天来料影响的设备类down机小于0.5h)
MTTR(平均恢复时间)≤1Hours
MTBF(平均故障间隔时间)≥1000hours
良率>99.7%
切割精度±30um
热影响≤70um



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